Sealed, embeddable, and made on the lines you already have
Conventional packaging forces a trade-off between protection, integration flexibility, and scalable production. Conformal coatings don’t survive impact; hermetic packaging survives but locks you into specialty fabs; overmolds are commodity but rigid. ThinTech™ combines all three: sealed and impact-survivable, embeddable in any host material, and produced on commodity flexible-substrate lines — as thin as 8 mil, with throughput bounded only by the line it runs on.
Six core technologies
U.S.-built pillars that deliver advanced microelectronics at conventional cost and capital intensity. Each is licensable individually or stacked: Microelectronic Encapsulation, System-in-Package, Advanced Substrates, Breakthrough Manufacturing, Biometric Smart Card, and Ultra-Wideband (frontier).
Microelectronic Encapsulation
Sealed, flexible devices as thin as 8 mil that survive heat, water, crushing, and impact — embeddable in metal, polymer, ceramic, or glass.
Advanced Substrates
PET-clad copper substrates that replace FR4 and polyimide — cost-efficient, flexible SiP assembly without sacrificing durability or environmental resistance.
Biometric Smart Card
On-card fingerprint enrollment and matching for payment, access, and MFA — a batteryless drop-in for conventional hot-lamination lines.
System-in-Package (SiP)
High-yield, scalable SiP that runs on standard manufacturing lines instead of capital-intensive overseas fabs — ultra-thin and flexible, with integrated shielding and antennas.
Breakthrough Manufacturing
Radiant Light Plate curing and core-layer assembly on existing infrastructure — high yield at low marginal cost, with no specialized overseas machinery.
Ultra-Wideband (Frontier)
Context-aware device architecture that tracks location and remotely activates or disables devices, payloads, and infrastructure — an early-stage frontier family.
Built in the USA, from pilot to scale
ThinTech™ is developed and proven in Sentry’s U.S.-based R&D laboratory in West Chester, PA — purpose-built to take products from pilot launch through full-scale production, then transfer the know-how to partner manufacturers. CQM-certified quality management and direct relationships with major U.S. and European chip makers shorten the path from license to production.
Engineered end-to-end, in-house
From innovation and design to card-body construction, advanced manufacturing, NFC/UWB and conductive film, biometric systems, secure chip integration, SiP and software integration, robotics — every discipline needed to take an idea to market lives under one roof.
U.S.-based, state-of-the-art equipment. RF testing, X-ray accuracy milling, pick-and-place down to .01005, ACF attachment, wire bonding — configured for rapid prototyping through full-scale production.
Go deep on the technology
If you’re interested in learning more about Sentry’s licensing, co-development, or information on commercial offerings, please fill out the information below. Engagements are handled directly by Sentry, with IP valuation and advisory support from Ocean Tomo, a J.S. Held company.