One platform, applied across high-growth markets

ThinTech™’s combination of ruggedization, ultra-thin form factor, U.S.-first supply chain, and low capital intensity opens applications that conventional packaging can’t reach — from chip-scale integration to secure credentials.

Where the platform fits

Markets we serve

Semiconductors & Advanced Packaging

SiP, encapsulation, and PET substrates enable thinner, heterogeneous packages and chiplet integration — chiplet processors, edge-AI modules, ultra-thin secure elements, and HPC and mobile SoC substrates.

Defense & Aerospace

Ruggedized, tamper-resistant encapsulation and secure integration address SWaP, reliability, and survivability — avionics modules, unmanned systems, soldier-worn devices, UWB tracking, and CAC/PIV as a FIDO2 derived-credential solution. Export classification in process; preliminary EAR-controlled (not ITAR/USML).

Smart Card Manufacturing

Prelaminate cores and drop-in encapsulation let card manufacturers add biometrics, metal, and illumination on existing hot-lamination lines — biometric, metal, OLED, and dual-interface smart cards.

IoT & Connected Devices

Ultra-thin, rugged encapsulation supports secure, miniaturized endpoints with integrated sensors — industrial sensors, asset-tracking tags, smart meters, and wearables, at volume.

Secure Credentials & Payments

Hot-lamination-compatible encapsulation integrates biometrics, displays, and antennas into ISO cards — biometric payment cards, OLED/illuminated cards, enterprise badges, and government and eID cards.

Healthcare & Medical Devices

Thin-profile SiP and biocompatible, fully sealed encapsulation enable durable, reliable medical electronics and active smart packaging — implantable biosensors, patient monitors, disposable diagnostics, and drug-delivery and tamper-evident devices.

Frontier adjacencies — optionality, not commitments

Where the platform’s properties open longer-horizon possibilities: post-quantum (PQC) crypto-agile smart cards, low-outgassing encapsulation for advanced computing, and ultra-dense SiP integration. Presented as optionality, not a commitment.

Not sure where your application fits? The same encapsulation, SiP, substrate, and manufacturing IP adapts across markets — talk to our team about your use case.

Find your application

If you’re interested in learning more about Sentry’s licensing, co-development, or information on commercial offerings, please fill out the information below. Engagements are handled directly by Sentry, with IP valuation and advisory support from Ocean Tomo, a J.S. Held company.