Conventional packaging forces a trade-off. ThinTech™ removes it.
System-in-Package, advanced substrates, and smart cards are capital-intensive, low-yield, and fragile — dependent on billion-dollar overseas fabs and slow thermal-cure processes. The result is high cost, long time-to-market, and ruggedized, ultra-thin form factors that stay out of reach for the applications that need them most.
ThinTech™ is a vertically integrated platform — encapsulation, System-in-Package, advanced substrates, and breakthrough manufacturing — that produces sealed, flexible, field-survivable devices and runs on existing flexible-substrate infrastructure. The platform is engineered to be transferred: licensed as IP, or co-developed alongside our R&D team.
A deep tech company with a vertically-integrated R&D laboratory
Sentry engineers ultra-thin, ruggedized microelectronics — sealed against water, heat, and impact — in a single, vertically integrated R&D laboratory in West Chester, PA.
Hardware, software, and the manufacturing process are developed in-house and protected by 169 patents and trade secrets — resulting in a proven, U.S.-built platform available to license or co-develop.
What sets Sentry apart
In-house R&D laboratory
Concept, prototyping, and production-scale manufacturing under one roof — so innovation moves from lab to line without external handoffs.
ThinTech™
Six core technologies — encapsulation, System-in-Package, advanced substrates, and more — unified in one ultra-thin platform built at conventional cost.
169 patents & trade secrets
A layered IP portfolio you can license in full or as a defined subset — patents, trade secrets, and manufacturing know-how.
The Sentry Stack
Proprietary hardware, software, and manufacturing process, integrated end-to-end — a complete platform to license, not a single point solution.
ThinTech™: ultra-thin microelectronic encapsulation
ThinTech™ reinvented microelectronic encapsulation by creating ultra-thin, durable, heat- and waterproof devices that are not only scalable to high volumes, but also low-cost. It works seamlessly with hot lamination, ensuring cost-effective, high-quality solutions for diverse applications without compromising yield or performance.
What you can license
Access the platform that already ships — as a license, a co-development partnership, or both. Each piece can be licensed individually or stacked to fit your roadmap.
The ThinTech™ platform
Access the full ThinTech™ platform — encapsulation, System-in-Package, advanced substrates, and breakthrough manufacturing — licensable individually or stacked.
The patent portfolio
License a full or defined subset of the patent portfolio, with field-of-use flexibility aligned to your target markets and negotiated royalty terms.
Manufacturing know-how
Structured technology transfer — process documentation, trade secrets, and proprietary methods — so you can produce on existing flexible-substrate lines instead of billion-dollar fabs.
Our partners
Sentry’s technology and quality have earned the trust of globally recognized enterprises across semiconductors, security, identity, and payments. Our partners and collaborators include leading silicon, biometric, and secure-element companies — proof that the platform performs in production:
Let’s talk about licensing ThinTech™
If you’re interested in learning more about Sentry’s licensing, co-development, or information on commercial offerings, please fill out the information below. Engagements are handled directly by Sentry, with IP valuation and advisory support from Ocean Tomo, a J.S. Held company.