SiP Manufacturing

Industrial-grade SiP, on the lines you already have

High-yield, scalable System-in-Package that runs on standard equipment instead of billion-dollar overseas fabs — ~25–50% lower cost, ultra-thin and flexible. License the process or co-develop.

Where the platform fits

Traditional SiP is capital-intensive, low-yield, and fragility-prone — dependent on cleanrooms, long lead times, and overseas chip-packaging fabs. PCB modules are cheaper but rigid; custom MCM/WLP is rugged but bespoke and costly. Each path forces a trade-off between ruggedization, form factor, sovereignty, and cost.

Markets we serve

Multi-chip integration

MCUs, sensors, radios, and passives in one ultra-thin package.

Infineon SLC39 secure element

Validated secure-element integration for trusted SiP designs.

Integrated shielding & antennas

Multi-layer shielding and bonded antennas across diverse substrates.

PET-clad copper substrates

Cost-efficient flexible substrates replacing FR4 and polyimide.

Sentry's embedded SiP

Sentry’s embedded SiP delivers all four: flexible and ultra-thin (as thin as 8 mil), mission-grade-roadmap ruggedization, U.S.-first production, and ~25–50% lower cost versus traditional secure modules. Sheet-format production scales rapidly to millions of units per year.

Validated, under NDA

Signal integrity validated across multi-chip SiP, pin-out tested across 8+ device classes, ~380°F operating tolerance, NFC ISO 14443 compliant — full validation data reviewable under NDA.

~25–50% lower cost, at scale. Sheet-format production on commodity flexible-substrate lines replaces capital-intensive overseas fabs — high yield, low marginal cost, millions of units per year.

License the SiP process

License the SiP process or co-develop on Sentry’s platform — request the data pack under NDA. Engagements are handled directly by Sentry, with IP valuation and advisory support from Ocean Tomo, a J.S. Held company.