Where the platform fits
ThinTech™ seals microelectronics as thin as 8 mil that survive heat, cold, moisture, crushing, and impact while staying flexible — IP67-equivalent sealing, ISO 10373 bend and torsion, and MIL-STD-810H-derived environmental protocols. Built for SWaP-constrained platforms where conventional packaging is too thick, too fragile, or too captive.
Markets we serve
Avionics modules
Sealed, flexible electronics for avionics where size, weight, and power are constrained.
Soldier-worn devices
Lightweight, sealed, impact-survivable electronics for soldier-worn and dismounted use.
Unmanned systems (UAS / drones)
Ultra-thin, ruggedized electronics for drones and unmanned platforms — survivable and SWaP-optimized.
UWB tracking & secure location
Context-aware UWB architecture for precision tracking and secure location systems.
US-built, trusted supply chain
US-based final assembly and test today, running on existing US flexible-substrate infrastructure, with a roadmap to more than 90% US content by 2027 — a U.S.-first alternative to captive overseas chip-packaging fabs.
Export status, stated honestly
Export classification is in process per device class — preliminary EAR-controlled, explicitly not ITAR/USML. Industrial-grade today, with a mission-grade roadmap; readiness is stated honestly throughout.
SWaP and survivability, validated. Sealed to IP67-equivalent, MIL-STD-810H-derived environmental protocols, ISO 10373 bend and torsion, and ~380°F operating tolerance — full validation data reviewable under NDA.
Engage on defense licensing
Engage under NDA — environmental, mechanical, and process validation data reviewable. Engagements are handled directly by Sentry, with IP valuation and advisory support from Ocean Tomo, a J.S. Held company.