What is ThinTech™
ThinTech, or ultra-thin microelectronic encapsulation, is the ability to construct highly durable, aesthetically beautiful, complex microelectronic devices, (in a variety of form factors), capable of being manufactured using hot lamination – the most common process used for high-volume, high-yield, high-quality, output.
High Volume. High Yield. Commercial Scale.
The Prelaminate Core Sheet, working in conjunction with other proprietary processes and in-house technologies, enables the creation of sophisticated devices, deliverable at commercial scale, at a cost and with the beauty that the market has never seen before.
“Our inventions and capabilities have led to the deployment of Commercial Platforms for multi-functional devices only previously imagined, that transform markets and reshape industries.”
- Mark Cox, Chief Scientist
Unrivaled Capabilities
– A World of Possibilities
This merger will allow Sentry Enterprise to offer unrivaled capabilities to a global market and unveil solutions in the Identity, Payment, Access Control, and Web3 markets that the world has never seen.
1140 McDermott Drive
Suite 101
West Chester, PA 19380
